Equipment for sale

SoS offers a variety of front and back-end equipment.

 

 

Equipement

Semitool (AMAT) Raider ECD 312

The RAIDER  ECD  312 system for 300mm single-wafer, automated, multi-chamber, electrochemical deposition delivers high throughput in a small footprint.

Complete system incl 2x Neslap HX300 chiller And integrated fire extinguishing system.


Tokyo Electron Trias High K CVD

CVD System, 12” <45nm process Vintage 20102 Chambers: CVD & ALD Process: NiOx, HfOx

Trias cluster: 2 LoadportsLM: Front endMain power distribution (MPD) Transfer module, TM

EX reactor, PM2:Plasma capability: No Includes:Ozonizer & H20 Box2 Touch screens ozonizer

High-k CVD reactor PM4:Thermal based depositionTransformer box (Hi-K) option elec box:

Manuals & Spareparts includedMachine is in absolute as good as new condition ex R&D facility

PM2: Hafnium Nickel Titaan Vanadium

PM4: Hafnium Nickel Titaan Ruthenium Strontium 

AMAT AKT 1600

Condition: un-refurbished    

Tool Model : AMAT 1600 PECVD    

Tool Serial Number : 6C102    

Vintage 2005    

Process:

PECVD iN,SiO2, i-a-Si,SiON and N+ a-Si    

Software Version: AKT7.3    

System Power Rating: 208 VAC 3-Phase    

Flat panel size: 320 x 352 mm    

(5) Process chambers:      
Film Capability SiN,      
SiO2,      
i-a-Si,      
SiON,      
N+ a-Si (Remote Plasma Clean)    

Includes: Chillers


 

ASMi A400

Basic configuration:

• ASMi A400 HT Oxide / Poly • Vintage 1998• Dual reactors /Dual boats • Boat Rotation (poly)

• 5 temperature zones• New CE certification

Final configuration TBD machine will be build to end-user specification 

AMAT Oasis clean

Condition “As is” 

Manufacturer:   Applied
Materials 
Type:   300mm Oasis clean Serial number:   414522 Date of manufacture:   2006  Software revision:   OA_B3.0_38

Configuration:

ChA Axiom (Dry strip)ChB Tempest (Wet etch, NH4OH, H2O2, HF) ChD Tempest (Wet etch, NH4OH, H2O2, HF)

Modules:

MainframeFI (Yaskawa robot)Bulkfill Chemical cabinetRotary vacuum pump (for ChA)Main AC boxGenerator rack Connection details:   208V 3fase 50/60Hz 240A 

Axcelis Fusion ES3 Asher

System Axcelis ES3 Asher Vintage Feb-2001300mm optional 200mm
Incl chiller, pumps, gasboxes decomissioned in working conditioning, in production till April 2022

System comes incl following spare parts.

Spare chamber module,All quarts parts used for 1 chamber Main ComputerMicrowave 3 pieces Lampcontrollers etc.Lamps approx. 75 pieces TouchscreenSMC foreline valveThrottle valve 

AMAT Centura High K

Tool Model : Centura 200mmProcess chamber is 100% complete, and was fully operational prior decommissioning. Incl gasbox and remote frame and all interfacing Condition "As Is"

 

BTU PV 614

Vintage 2013
Heater type IR Lamp
Belt Width 36 cmConveyor Speed cm/min 56-560 15, 38Load station 38 cm
Unload station 38 cm
Number of heated zones 6
Maximum Temprature rating 1000°C
Operation Temprature range 200-900°C
Forced Air Cooling Length 229 cm Atmosphere, CDA , Typicle (scfh, m3/hr)
900, 25.2
Process Exhaust, Venturi Assist 2
Electrical 400/230 VAC 112 AMP 81 KVA 50/60 Hz
Overall Length 576 cm
Overall Width 96,5 cm
Overall Height 184 cm 


Applied Baccini Soft Line

Vintage 2009
Upgraded touchscreen/PC/softwareMachine used only in R&D in condition as new

 

LAM 490

LAM 490 AutoEtcher

  Polysilicon: 490
  Wafer size: 6 inch
  Upgraded TFT monitors
  Incl maintenance console
  Conditon: AS IS (No Chiller, No pump but with ENI RF Generator)

Features:

  Single-wafer processing
  Fully automated microprocessor control 
  Cassette-to-cassette wafer processing 
  Vacuum load locked
  Programmable, variable electrode spacing 
  Endpoint detection
  Configurable for 3-inch to 6-inch wafers 
  Stand-alone or bulk-head mount configuration 

AMAT Centura MXP Chamber

200mm
ESC
Complete incl Turbo, RF-Match 


 

FSI POLARIS 3500

This 200/ 300mm track system is built on a proven 200mm platform, the POLARIS 3500 Together with this machine a spare Staubli/FSI RX 90B Robot

This machine has been decommissioned by SoS and is stored at our Nijmegen warehouse. More detail info is available on request. Condition: "As is where is"

SEMIX TAZMO SOG Track

Basic configuration:

       Semix Tazmo

       150mm

       2 load 2 unload stations 

       1 coater

       2 SOG dispense lines

       3 bakplates

       Machine serial nr : on request

Options:

  Refurbishment

       New CE certification

       Installation and warrantee 


 

PolyFlow Triple Tower II S-417

This PolyFlow system can be offered fully refurbished incl our own PLC system controller (Siemens S7)

KLA Tencor INSPEX EAGLE

Condition: "As is"
Wafer Size:   150mm capable 4” up to 8"
Equipment Details:
Wafer inspection system
C huck, 6”

Prealigner, 6”
Cassette to cassette handling
(2) Ports
ZEISS Microscope
Including manuals




LAM 490

LAM 490 AutoEtcher

  Polysilicon: 490
  Wafer size: 6 inch
  Upgraded TFT monitors
  Wafer detection
  Incl maintenance console
  Conditon: AS IS (No Chiller, No pump but with ENI RF Generator)

Features:

  Single-wafer processing
  Fully automated microprocessor control
  Cassette-to-cassette wafer processing
  Vacuum load locked
  Programmable, variable electrode spacing
  Endpoint detection
  Configurable for 3-inch to 6-inch wafers
  Stand-alone or bulk-head mount configuration 

KLA Tencor INSPEX EAGLE

Condition: "As is"
Wafer Size:   150mm capable 4” up to 8"
Equipment Details:
Wafer inspection system
C huck, 6”

Prealigner, 6”
Cassette to cassette handling
( 2) Ports
ZEISS Microscope
Including manuals


 

LAM 490

LAM 490 AutoEtcher

  Polysilicon: 490
  Wafer size: 6 inch
  Upgraded TFT monitors
  Wafer detection
  Incl maintenance console
  Conditon: AS IS (No Chiller, No pump but with ENI RF Generator)

Features:

  Single-wafer processing
  Fully automated microprocessor control
  Cassette-to-cassette wafer processing
  Vacuum load locked
  Programmable, variable electrode spacing
  Endpoint detection
  Configurable for 3-inch to 6-inch wafers
  Stand-alone or bulk-head mount configuration 

KLA TENCOR Surfscan 4500

SN 1289-395 

 

SSEC / Veeco ML 330

Single wafer cleaning system , 8" Vintage 2005

WaferStorm Wet Processing Platform
The WaferStorm platform is the industry choice for a number of critical solvent-based processes in the advanced packaging, MEMs, RF, Data Storage and Photonics markets. The ML 3300 system is well suited for R&D and pilot environments. 

TEL Tactras RLSA Etch Chamber

TactrasTM RLSATM provides an innovative, new plasma technology that TEL has been optimizing for years. Microwave technology provides high selectivity and excellent etch- profile control with low electron temperature of the radical-rich process by diffusion plasma. In addition, the output microwave stability, high repeatability, and process operation range has been improved with microwave broadband technology which enables precise control of the radical/ion ratio for high profile controllability. TactrasTM RLSATM has a high market share for a critical application in leading-edge logic devices. 

RLSA Chamber information :ESC for wafer with Dual He CoolingNihon Koshuha Microwave Generator / Model is MKS 050B04C-OSC-V

Turbo Pump:SHIMADZU / Model is FT2301D Generator Details:

Top MKS-050B04 PS-V Bottom Daihen RGA-20C

Gas Box Configuration :
1 N2      5 NF3
2 TSA    6 SiH4
3 Ar
4 H2 

 

Centrotherm E2000 320-4

PECVD
Vintage 2004
Complete system incl all hardware.

Tube 1 &2 silicon nitride (SiN)

Ar
N2
NF3
NH3
SiH4
H2

Tube 3&4 Silicon Oxynitride (SiON)

Ar
N2
N2O
NH3
SiH4
H2 

Akrion Goldfinger Velocity

Single wafer cleaning system , 12" Vintage 2007

Defectivity Improvement

The   Velocity  single wafer product line is focused on improving defectivity. This includes removal of particle and residue contamination from the wafer frontside, backside and edge.Defects are removed without physical damage to sensitive structures and without film etching. This is accomplished using advanced physical clean technologies – Goldfinger Megasonics, Jetstream Nano and Backside Megasonics. Watermark-free performance is available with Sahara dry. The Velocity is available in 4 or 6 chamber versions, each with stacked chambers to minimize footprint. The technology and platform are used for particle removal (post deposition, sensitive structures, backside and post post CMP) and post etch/ash (FEOL and BEOL) applications.

 

HITACHI M712

Manufacturer:   HITACHI
Type:   300mm M712 mainframe

M711 setup one Etch chamber 
Date of manufacture:   2006

Software revision:   1.07 PMv.02.16M

Configuration:

Etcher, 12"
(3) Cassettes Positions
SECS II Interface: HSMS
Neslab coolflow III ChillerPower supply: 208 VAC, 3-Phase, 50/60 Hz

Mainframe:
Robot P/N: CR-712V HITACHI 3 position Loader 

Chamber:
ESC Type: Bipolar
Endpoint type: Hitachi EPD monitor ePMv02.16M SHIMAZU EC TMP
3203LMC-K1 EC TMP Controller
DAIHEN ES7-IIA EC Source generator
PEARL CF-500-400K EC Bias generator 

Gas configuration:
Line / EC1 / Strip
1 / Ar
2 / C12

3 / SF6
4 / HBr
5 / CF3
6 / CH4
7 / NF3
8 / O2
9 / N2
10/ SF6
11/ C12
12/ O2