News

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10-12-2013 SEMI Reports Third Quarter 2013 Worldwide Semiconductor Equipment Figures; Billings $7.65 Billion
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03-12-2013 2013 Semiconductor Equipment Sales Forecast $32 Billion; Strong Growth Forecast for 2014
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25-11-2013 New Taiwan Exhibition Co-Location Bridges LED Manufacturing and Lighting Supply Chains
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19-11-2013 North American Semiconductor Equipment Industry Posts October 2013 Book-to-Bill Ratio of 1.05
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12-11-2013 Semiconductor Manufacturing: ASMC 2014 Offers Visibility and Opportunity for Presenters — Deadline November 28
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12-11-2013 Slight Decline in Third Quarter 2013 Silicon Wafer Shipments
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06-11-2013 Focus on the "Power of Innovation" — with Keynotes from AIST, GlobalFoundries, and Soitec at SEMICON Japan 2013
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05-11-2013 Plastic Electronics Conference to Rotate Between Dresden and Grenoble Beginning in 2014
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21-10-2013 North American Semiconductor Equipment Industry Posts September 2013 Book-to-Bill Ratio of 0.97
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08-10-2013 Benedetto Vigna of STMicroelectronics Honored with European SEMI Award 2013
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07-10-2013 Countdown for SEMICON Europa and Plastic Electronics 2013
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03-10-2013 SEMI Announces Silicon Wafer Shipment Forecast
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02-10-2013 From Smart Cars to Smart Cities: Shaping the Future of Microelectronics at ITPC 2013
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30-09-2013 Total Cost of Ownership Guide for PV Manufacturing Closes Communication Barrier
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23-09-2013 Spotlight on New Material Requirements and Outlook for Memory, Logic, MEMS, Beyond-CMOS Devices, and More - at the SEMI Strategic Materials Conference 2013
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20-09-2013 North American Semiconductor Equipment Industry Posts August 2013 Book-to-Bill Ratio of 0.98
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19-09-2013 Plastic Electronics 2013: Deep Insight into an Industry on the Edge of Commercialization
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17-09-2013 Leading Packaging and Test Experts to Gather at SEMICON Europa 2013
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12-09-2013 Ready for Prime Time? Manufacturability and Commercialization Take Center Stage at Plastic Electronics 2013
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10-09-2013 European Path to 450mm and Next-Generation Fab Highlights 2013 SEMICON Europa
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10-09-2013 SEMI Reports Second Quarter 2013 Worldwide Semiconductor Equipment Figures; Billings US$ 7.55 Billion
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06-09-2013 SEMICON Europa to Rotate Between Dresden and Grenoble Beginning in 2014
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05-09-2013 Next Level of MEMS Industry Development to be Examined at SEMICON Europa
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04-09-2013 European 3D TSV Summit: “Application Ready” Theme to Focus on Both Business and Technology Aspects
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03-09-2013 Fab Equipment Spending Up 25% in 2014
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20-08-2013 North American Semiconductor Equipment Industry Posts July 2013 Book-to-Bill Ratio of 1.00
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08-08-2013 Market and Technology Drivers to Bring 3D-IC to Production
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06-08-2013 Increase in Second Quarter 2013 Silicon Wafer Shipments
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03-08-2013 SEMI Commends U.S. Senators Brown and Blunt for Bipartisan Problem-Solving and Introduction of Advanced Manufacturing Bill
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31-07-2013 SEMI Networking Day – Italy Event to Focus on Latest Advances in MEMS Technology
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