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FlexTech Completes Flexible Hybrid Electronics Projects with ENrG, nScrypt, and PARC

11-05-2016

SAN JOSE, Calif. ─ May 11, 2016– FlexTech, a SEMI Strategic Association Partner, today announced the formal completion of three flexible hybrid electronics (FHE) R&D projects under its U.S. Army Research Laboratory  (ARL) technology investment agreement.  The completed projects are with ENrG for a flexible ceramic substrate; nScrypt and NovaCentrix for a next-generation three-dimensional (3D) printing tool for creating complex and functional objects; and PARC, a Xerox company, for a flexible sensor platform.